DyneCrystal Dual-Engine Distributed System
Overview
COB (Chips on Board) packages the chip on the board, which is
to adhere the bare chip to the interconnection substrate with conductive
or nonconductive adhesive, and then with wire bonding to realize its electrical connection.
Compared with similar products on the market,
Danacoid microLED COB adopts the industry's most advanced rank-and
column drive and Press Fit packaging technology; thas higher protection
and can achieve IP67 dustproof and waterproof and 1kg impact drop test;
display performance can reach up to 1200bit, 18bit gray scale and 20000:1
contrast ratio; and it can also achieve seamless and free splicing;
P1.26 and P0.84 ultrafine pitch can meet the special customization needs
of customers in different application scenarios.
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Applications
DyneCrystal Technology Advantage
DyneCrystal Application Solutions
DyneCrystal Application scenario
